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Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BUJ105AX
GENERAL DESCRIPTION
High-voltage, high-speed planar-passivated npn power switching transistor in a plastic full-pack envelope intended for use in high frequency electronic lighting ballast applications, converters, inverters, switching regulators, motor control systems, etc.
QUICK REFERENCE DATA
SYMBOL VCESM VCBO VCEO IC ICM Ptot VCEsat hFEsat tf PARAMETER Collector-emitter voltage peak value Collector-Base voltage (open emitter) Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Total power dissipation Collector-emitter saturation voltage Fall time CONDITIONS VBE = 0 V TYP. 0.3 11 20 MAX. 700 700 400 8 16 32 1.0 15 50 UNIT V V V A A W V ns
Ths 25 C IC = 4.0 A;IB = 0.8 A IC = 4.0 A; VCE = 5 V IC = 5 A; IB1 = 1.0A
PINNING - SOT186A
PIN 1 2 3 base collector emitter DESCRIPTION
PIN CONFIGURATION
case
SYMBOL
c b
123
case isolated
e
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134) SYMBOL VCESM VCEO VCBO IC ICM IB IBM Ptot Tstg Tj PARAMETER Collector to emitter voltage Collector to emitter voltage (open base) Collector to base voltage (open emitter) Collector current (DC) Collector current peak value Base current (DC) Base current peak value Total power dissipation Storage temperature Junction temperature CONDITIONS VBE = 0 V MIN. -65 MAX. 700 400 700 8 16 4 8 32 150 150 UNIT V V V A A A A W C C
Ths 25 C
THERMAL RESISTANCES
SYMBOL Rth j-hs Rth j-a PARAMETER Junction to mounting base Junction to ambient CONDITIONS With heatsink compound in free air TYP. 55 MAX. 3.95 UNIT K/W K/W
February 1999
1
Rev 1.000
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BUJ105AX
ISOLATION LIMITING VALUE & CHARACTERISTIC
Ths = 25 C unless otherwise specified SYMBOL Visol PARAMETER R.M.S. isolation voltage from all three terminals to external heatsink CONDITIONS f = 50-60 Hz; sinusoidal waveform; R.H. 65% ; clean and dustfree MIN. TYP. MAX. 2500 UNIT V
Cisol
Capacitance from T2 to external f = 1 MHz heatsink
-
10
-
pF
STATIC CHARACTERISTICS
Ths = 25 C unless otherwise specified SYMBOL ICES,ICBO ICES ICEO IEBO VCEOsust VCEsat VBEsat hFE hFE hFEsat PARAMETER Collector cut-off current
1
CONDITIONS VBE = 0 V; VCE = VCESMmax VBE = 0 V; VCE = VCESMmax; Tj = 125 C VCEO = VCEOMmax (400V) VEB = 9 V; IC = 0 A IB = 0 A; IC = 10 mA; L = 25 mH IC = 4.0A;IB = 0.8 A IC = 4.0A;IB = 0.8 A IC = 1 mA; VCE = 5 V IC = 500 mA; VCE = 5 V IC = 4.0 A; VCE = 5 V
MIN. 400 10 13 8
TYP. 0.3 1.0 14 23 11
MAX. 0.2 0.5 0.1 1 1.0 1.5 34 36 15
UNIT mA mA mA mA V V V
Collector cut-off current Emitter cut-off current Collector-emitter sustaining voltage Collector-emitter saturation voltage Base-emitter saturation voltage DC current gain
DYNAMIC CHARACTERISTICS
Ths = 25 C unless otherwise specified SYMBOL PARAMETER Switching times (resistive load) ton ts tf Turn-on time Turn-off storage time Turn-off fall time Switching times (inductive load) ts tf Turn-off storage time Turn-off fall time Switching times (inductive load) ts tf Turn-off storage time Turn-off fall time CONDITIONS ICon = 5 A; IBon = -IBoff = 1 A; RL = 75 ohms; VBB2 = 4 V; TYP. MAX. UNIT s s s s ns s ns
0.65 1.8 0.3
1 2.5 0.5
ICon = 5 A; IBon = 1 A; LB = 1 H; -VBB = 5 V ICon = 5 A; IBon = 1 A; LB = 1 H; -VBB = 5 V; Tj = 100 C
1.2 20
1.7 50
1.4 25
1.9 100
1 Measured with half sine-wave voltage (curve tracer).
February 1999
2
Rev 1.000
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BUJ105AX
+ 50v 100-200R
IC
90 %
ICon
90 %
10 %
Horizontal Oscilloscope Vertical 300R 30-60 Hz 6V 1R
IB
ts ton toff IBon 10 % tr 30ns -IBoff
tf
Fig.1. Test circuit for VCEOsust.
Fig.4. Switching times waveforms with resistive load.
IC / mA
VCC
250
LC
IBon
100 10 0 VCE / V
LB T.U.T.
-VBB
min VCEOsust
Fig.2. Oscilloscope display for VCEOsust.
VCC
Fig.5. Test circuit inductive load. = 300 V; -VBE = 5 V; LC = 200 uH; LB = 1 uH
VCC
ICon 90 % IC
RL VIM 0 tp
IB
RB T.U.T.
ts toff IBon
10 % tf t
T
-IBoff
t
Fig.3. Test circuit resistive load. VIM = -6 to +8 V VCC = 250 V; tp = 20 s; = tp / T = 0.01. RB and RL calculated from ICon and IBon requirements.
Fig.6. Switching times waveforms with inductive load.
February 1999
3
Rev 1.000
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BUJ105AX
120 110 100 90 80 70 60 50 40 30 20 10 0
PD%
Normalised Power Derating
VCEsat/V 2.0
1.6 IC=1A 1.2 2A 3A 4A
0.8
0.4
0
20
40
60
80 Tmb / C
100
120
140
0.0 0.01
0.10 IB/A
1.00
10.00
Fig.7. Normalised power dissipation. PD% = 100PD/PD 25C = f (Ths)
Fig.10. Collector-Emitter saturation voltage. Solid lines = typ values, VCEsat = f(IB); Tj=25C.
HFE 50
VBESAT/V 1.4
30
Tj=100C
1.3
20
25C
1.2
15
1.1
-40C
10
1
0.9
5
-40C
0.8
25C
Tj=100C
0.7
2
VCE=1V
0.6
0.01
0.05
0.1
0.3 IC/A
1
2
3
5
10
0.5 0.1
0.5
1 IC/A
2
5
10
Fig.8. Typical DC current gain. hFE = f(IC) parameter VCE
Fig.11. Base-Emitter saturation voltage. Solid lines = typ values, VBEsat = f(IC); at IC/IB =4.
HFE 50
VCESAT/V 0.6
30
Tj=100C
0.5
Tj=100C
20
25C
0.4
15
-40C
10
0.3
0.2
25C
5
-40C
VCE=5V
0.1
2 0.01
0.05
0.1
0.3 IC/A
1
2
3
5
10
0 0.2
0.4
0.6
1 IC/A
2
5
6
Fig.9. Typical DC current gain. hFE = f(IC) parameter VCE
Fig.12. Collector-Emitter saturation voltage. Solid lines = typ values, VCEsat = f(IC); at IC/IB =4.
February 1999
4
Rev 1.000
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BUJ105AX
10
Zth / (K/W)
BU1706AX
IC/A 11
10
0.5 1 0.2 0.1 0.05 0.02
tp
9
8
7
0.1
6
5
P D 0.01 D=0 0.001
tp
D=
-5V
T t
4
-3V
3
T 10u 100u 1m 10m 100m t/s 1
2
-1V
1
1u
10
100
0 0 100 200 300 400 500 VCEclamp/V 600 700 800
Fig.13. Transient thermal impedance. Zth j-hs = f(t); parameter D = tp/T
Fig.15. Reverse bias safe operating area (Tj < Tjmax) for -Vbe = 5V,3V & 1V.
VCC
LC
IBon
VCL LB T.U.T.
-VBB
Fig.14. Test circuit for reverse bias safe operating area. Vclamp < 700V; Vcc = 150V; -Vbe = 5V,3V & 1V; LB = 1H; LC = 200H.
February 1999
5
Rev 1.000
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BUJ105AX
MECHANICAL DATA
Dimensions in mm Net Mass: 2 g
10.3 max 3.2 3.0
4.6 max 2.9 max
Recesses (2x) 2.5 0.8 max. depth
2.8 6.4 15.8 19 max. max. seating plane 15.8 max
3 max. not tinned 3 2.5 13.5 min. 1 0.4
M
2
3 1.0 (2x) 0.6 2.54 0.5 2.5 1.3 0.9 0.7
5.08
Fig.16. SOT186A; The seating plane is electrically isolated from all terminals.
Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8".
February 1999
6
Rev 1.000
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BUJ105AX
DEFINITIONS
Data sheet status Objective specification Product specification Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. (c) Philips Electronics N.V. 1999 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
February 1999
7
Rev 1.000

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